JPS61125049U - - Google Patents

Info

Publication number
JPS61125049U
JPS61125049U JP1985008996U JP899685U JPS61125049U JP S61125049 U JPS61125049 U JP S61125049U JP 1985008996 U JP1985008996 U JP 1985008996U JP 899685 U JP899685 U JP 899685U JP S61125049 U JPS61125049 U JP S61125049U
Authority
JP
Japan
Prior art keywords
arm
swinging
bonding
bonding arm
cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985008996U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0230838Y2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985008996U priority Critical patent/JPH0230838Y2/ja
Publication of JPS61125049U publication Critical patent/JPS61125049U/ja
Application granted granted Critical
Publication of JPH0230838Y2 publication Critical patent/JPH0230838Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1985008996U 1985-01-25 1985-01-25 Expired JPH0230838Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985008996U JPH0230838Y2 (en]) 1985-01-25 1985-01-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985008996U JPH0230838Y2 (en]) 1985-01-25 1985-01-25

Publications (2)

Publication Number Publication Date
JPS61125049U true JPS61125049U (en]) 1986-08-06
JPH0230838Y2 JPH0230838Y2 (en]) 1990-08-20

Family

ID=30488794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985008996U Expired JPH0230838Y2 (en]) 1985-01-25 1985-01-25

Country Status (1)

Country Link
JP (1) JPH0230838Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136334U (en]) * 1987-02-28 1988-09-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136334U (en]) * 1987-02-28 1988-09-07

Also Published As

Publication number Publication date
JPH0230838Y2 (en]) 1990-08-20

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